Efficient
10x larger models| 100x efficiency
First-class hardware support for dual-sparsity neural networks for low memory footprint and high efficiency.
WLCSP for circuit integration
Bare die for systems in package (SiP) integration
Specifications:
For System on a Chip (SoC) integration
Specifications:
SPU + MCU for on-device voice cleanup and flexible commands in a single affordable package
Specifications:
Specifications:
Specifications:
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